Aluminum Nitride Ceramic PCB

Aluminum Nitride PCB (AlN) is the best material for electronic circuits that need high current or temperature. It has good thermal conductivity and dielectric strength and low thermal expansion features help use high-power LEDs, ultra-low temperature vacuum chambers, and other projects.

What is a Ceramic PCB?

Ceramic PCB board also called green boards, green used due to different features for environmental conditions. Then the conventional FR4 ceramic board comes with some toxic materials and also has small carbon amount.

The ceramic material used for PCB is an advanced level material thas faces different industrial process and have metallic components.

These materials provide good conductivity, moisture resistance and stable structure.  These boards are part of high power electronic devices, Radio frequency, and microwave electronics. and other uses.

Features of Aluminum Nitride Ceramic PCB

• It has a high thermal conductivity of about 170 W/mK  so best to dissipate heat.
• Thermal expansion configuration with silicon helps to make direct chip connection methods
• It is an insulated material with high dielectric strength and volume resistivity.
• It is lower weight than other ceramic materials
• It is resistant to thermal vibration and has a strong structure.
• It has less dielectric losses for high-frequency circuits.
• It has features to handle high-temperature values of more than 1000 degrees with less distortion.
• It has compatibility with soldering and metallization processes.

Applications of Aluminum Nitride Ceramic PCB

• It used for high-density electronic circuits such as inverters and converters
• it is part of vehicle power and charging circuits.
• Downhole drilling tools used on this board
• medical lasers and thermal therapy devices use this board
• It is used for radar and LiDAR circuits
•  It used for hybrid microcircuits
• it used LED that needed high-intensity
• It is part of RF amplifiers and filters.
• It also used for satellite electronics

Manufacturing Process of Aluminum Nitride Ceramic PCB

Substrate

• First of all aluminum nitride powder is made in billet with the use of cold isostatic pressing. Then binder material is used to handle materials.
• The shaped billet is sintered more than  1800°C in the presence of a nitrogen atmosphere.
• Sintering fuses in AIN powder in a dense ceramic structure. Then AlNboad ground and polished for a certain value of thickness

Metallization

• In this step, a thick paste with tungsten is allowed to make traces. Thin film metals such as copper or gold are applied using sputtering or plating.
• High-temperature connected  metallization to the AlN substrate

Multilayer Creation

• Double-layer boards are made and laminated with adhesive layers. Vias and through holes are drilled with the use of lasers and conductive pastes is filled in these holes.
• Blind and buried vias connected  inner layers

Housing Integration

• AlN substrates have features to make connections with hermetic packages. Different sealants such as  braze or glass are used

Competitiveness of PCBONLINE in Aluminum Nitride PCB Manufacturing

PCBONLINE uses DPC technology for the creation of aluminum nitride boards. Copper and aluminum nitride substrates are connected with the use of magnetron sputtering and ceramic board comes with metallic crystallization features. Boad comes with features and provides good bonding with the chip and the substrate effectively.

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Differences between Aluminum Nitride, Alumina, and FR-4

Parameter	Aluminum Nitride	Alumina	FR-4
Temperature Resistance	1000-1500°C	1000-1200°C	130-170°C
CTE (Coefficient of Thermal Expansion)	4.0 ppm/K	6.5-7 ppm/K	17-20 ppm/K
Flexural Strength	330 MPa	300 MPa	180 MPa
Thermal Conductivity	170-200 W/mK	24-30 W/mK	0.25-0.5 W/mK
Dielectric Constant	8.8	9.2-10	4.2-4.6
Dielectric Strength	15-25 kV/mm	10-15 kV/mm	15-30 kV/mm