Construction of Double Sided PCB

Hello, readers welcome to the new post. In this tutorial, we will discuss Construction of Double Sided PCB. The double-sided board is made with two copper layers at the upper and lower sides. The copper pads and copper traces exist on board sides and two copper layers are configured with plated through holes. These boards do not have inner layers

This type of board is a low-cost option for different electronic projects and devices. For double side boards components are connected on both sides.

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Table of Contents

Double Sided PCB Stack-up

The upper layers of double-sided boards come with conductive layers. then the dielectric layer is applied which is called the base material. At the lower part of the board, there are other conductive layers. Dielectric layers are between two conductive layers.
The conductive layer is made with copper and comes with good electrical conductivity features and a low-cost board. Gold or silver is used for making conductive layers.
the base layers are made with the use of different materials such as FR4, polyimide, PTFE, and metals and are configured on the substrate.
Sometimes non-conductive base materials are used that work as insulators for two upper and lower conductive layers.
If there are base layers made with metal then dielectric layers are used for insulation between layers to control short circuit
Over the base and conductive layers there is surface finishing, solder mask and at last silkscreen layer applied.
Surface finish used for protection of copper layers and avoid oxidation and corrosion on board.
Solder mask used for stopping the creation of solder bridges and undesired connections. The silkscreen has labeling details of the components connected.

Types of double-sided printed circuit boards

Rigid Double-sided PCB:

It is the basic type of double-sided board made with the use of FR4 materials and is best ot used for handling electrical features and low cost option

Flexible Double-sided PCB:

It is made with use of polyimide materials and comes with a good flexible nature and low-cost features. It is used for projects that need low-weight

Flex-Rigid Double Sided PCB:

It comes with a rigid and flexible material and has features of both flexibility and rigidity.

Metal Core Double-Sided PCB:

This board comes with copper, aluminum, and some other metals. So best for heat dissipation and used in LEDs devices

Double-Sided PCB Manufacturing Process

DFM Check:

DFM is a process used for board manufacturing and this process helps to check copper, solder mask, silkscreen, and drilling through using software and offers details for board manufacturing. If there is any issue found in the DFM report ask customers to provide the required details and solve the issue for proper manufacturing

Penalization Process :

The penalization helps to provide details for ups set on the standard panel used for production. Then get different penalization results such as core scaling, maskless results, draw results, drill output, and etching testing. That rough data is forwarded to make a board.

Panel Cutting:

In this step material reached at manufacturing point in the form of a larger sheet of about 41*49’’. There is a need to cut board materials based on board thickness features.

Drilling:

Here boards are configured with fixtures to get the required drilling process. then drilling program was added to the drilling machine and the drilling machine made holes based on board drill layers. In some applications via fill, blind vias, and buried vias are used for that applications special processes are used.

Copper Plating:

In this step, copper plating is applied on the PCB surface making boards thick and offering copper connection with layers of surface pads. The boards are drilled for connection layers with layers.

Imaging Outer Layers:

this method is used for transferring circuits on copper through the use of films. The image transfer there is a need for protection film. With that oxidation not used for the surface so clean board.

Inspection of Outer Layers:

Check the image’s accurate registration of external layers. Normally this phase checks short circuits, broken connections, and if there is alignment of the board. AOI is used for checking these errors and providing results in image form.

Etching:

This phase needed to remove undesired copper from the board. When etching is complete, circuit images exist on board. Etching is done with the use of chemical solutions.

Applications of Mask: