What is PLCC Packages | SMD Plastic Leaded Chip Carrier – How Do We Use Them?

PLCC full form is plastic leaded chip carriers and it is the surface of mounted integrated circuit package that is used for electronic devices. PLC packages come with square or rectangular shapes and leads coming out from all sides. Pins are connected in grid combination and mounted on board with the use of soldering.

PLCC packages come in different sizes. It comes with a pin range from 20 to 84 or higher. They are made with use of plastic and transported layers exist that help to see the inner structures of Ics.

Types of PLCC Packages

 Standard PLCC

This PLCC package is used for different uses and has a square design that helps to fit in small spaces easily and has 20 to 84 pins configuration and comes in different sizes ranges.

 Miniature PLCC

It is a small package and has a small size and low pins that can be about 16 to 52 pins.

 Thin Quad Flat Package (TQFP)

Thin PLCC packages come in different standard PLCC packages that have thin body designs. It is used where limited space exists and has a size range of 20 to 84 pins. The quad packages come with  44 to 84 pins.

 Enhanced PLCC

This type of PLCC package comes with a heat sink on the upper part of the package. So heat sinks easily dissipate heat from ICs and are best used for high power uses.

 Ceramic PLCC

This package comes with a ceramic body in place of plastic materials. Ceramics is best to use for extreme conditions and has higher thermal features and reliability than plastic. It used for high-temperature conditions

 PLCC vs. DIP

PLCC

• It comes with a square shape and has leads.
• It comes with larger pins as compared to DIP packages and is used for complex designs.
• It is used for space-constrained devices.
• It has high heat dissipation features
• CLose space and small sizes pins are sensitive and can break

DIP

• It comes with a rectangle shape and pins are in parallel row combination.
• It has less number of pins and is used for simple projects.
• Its large spacing between pins makes it high in weight and covers a larger space board.
• It needed heat sinks due to less heat dissipation features.
• It is used for prototyping circuits.

PLCC vs. BGA

PLCC

• It comes in a square or rectangular shape.
• it has moderate to larger pins
• It has high heat dissipation and needs heat sinks.
•  it can made easily and used for automated assembly
• It used for Industries and consumer electronics

BGA

• It has PINs from moderate to high and is best for complicated and high performance.
• It has enough space since solder balls provide small packages.
• It can efficiently dissipate heat and large surfaces of solder balls.
• it faces a complex manufacturing process
• It used for high-performance applications like GPUs, CPUs, and networking devices

PLCC Package features

• PLCC packages are low-cost and used for different applications that can easily made.
• it has different sizes and pins and is best for different types of circuits and applications.
• It can easy to assemble and mounted on board. The use of automated devices that reduces production cost and time
• It comes with a window at the upper part that helps to see the inner structure.

Construction of PLCC Package

 Body:

• its body is made with plastic materials that can molded in any design and shape. Plastic is thermoset material and make harder after molding

Leadframe:

• The leads of packages are connected with a lead frame that is a metallic structure used for supporting leads and connection of ICs. The leadframe is of copper or a copper alloy.

IC chip:

• In this package, ICs are connected with a lead frame through the use of a wire bonding process. Thin wires are used for the connection of pads on ICs with leads on the lead frame.

Mold compound:

• After making the connection of the IC chip with the lead frame assembly is covered in mold compound and plastic materials protect IC and wire bonds. The mold compound is epoxy materials that cured to mold

Package marking:

• There are marking exits on the surface of packages. That has details of manufacturers, part numbers, and data codes. These markings are made with use of laser-etched onto the surface of the package.

PLCC Packages and Troubleshooting and Repair

• First of all, check PLCC packages to find any faults with the naked eye. Check that there is any discoloration, cracks or leakages exist. Check the connection if soldered packages are on board. Fid there are any breaks or damage to solder joints. Make sure package pins are not broken or bent.
• When you make sure there is no damage to the board make sure that IC is working well. For this use a multimeter for testing IC.
• If IC working well and the connection is intact then replace the package. For this remove packages on baord and repairing for new one.