What is PCB surface finishing, Features, Applications, Advantages and Disadvantages

Hello, readers welcome to the new post. In this post, we will discuss What is PCB surface finishing. PCB is a very important component of the electronic industry and comes with copper layers at the surface. If there is no protection existing at the surface that causes the oxidization of coppers placed at the surface of the board damages the board and reduces the operating life of the board.

To protect the circuit created on the board and proper interlinking of the components on the board there is surface finishing of the PCB is done.

Selecting the accurate surface finish technique for your PCB board is not a tranquil job. Not single for PCB board but a surface finish must also be harmless for the atmosphere. That’s why PCBWay uses the constituents registered under RoHS acquiescence on all its circuit boards. To see the finest surface finish technique for your PCB requirements.

Hot Air Solder Leveling (HASL)

• At the industrial level, there is commonly used surface finishing of PCB is done through HASL or hot air Solder Leveling.
• It is a simple process through there is placing of the PCB board in the lead alloy having a molten state.

• The main advantage of using the HASL is that the board can place the temperature values up to two sixty-five centigrade which helps to find any fault that exists in the board and saves time and cost for another component assembly on board.
• There are 2 main directions either horizontal or vertical where the HASL process is done. For getting the uniform coating is horizontal procedure is used by PCBWAY.

HASL Advantages

• It can easily be reworkable
• There is operating life of PCB boards through this finishing is very good and on time
• It can easily get through the local market.

HASL Disadvantages

• There is lead used in this process that is harmful to health
• It causes thermal shocks
• It is not preferred for the fine-pitch
• It comes with a non-smooth surface.

Organic Solderability Preservative or OSP

• There is the application of a very thin sheet of substances placed at the surface through a conveyorized procedure that helps to make protective layers at copper to prevent oxidation.

• There is the usage of water-based components that help to make copper work for soldering in a protective state.
• When OSP is applied to the board the thickness of the board becomes four to twenty-four micro inches.

OSP Advantages

• It is a less expensive process
• There is no existence or usage of lead
• It is a very easy process and also handles easily.

OSP DisAdvantages

• The results of this process are limited
• Its working life is very limited
• It does not offer the thickness-measuring

ENIG

• ENIG is to layer coated with metals of two to eight gold for one to two forty. There is a coating of Nickel used for soldering the component.
• Since it followed the RoHs and is preferred for local use. There is gold coating in place and nickel and less resistance for small-size gold.

ENIG Advantages

• It is used for a long duration or has a lifetime operation
• It is also without the use of ENIG
• It is preferred for Plated through-holes
• Comes with the Flat Surface

ENIG Advantages

• This process is complex as well expensive

• It can be remarkably workable and plagiarism-free
• It can be effective through the black pad
• It comes with the loss of signal

Immersion Silver

• It is the best option than ENIG for flat surfaces, Its operating life is about one year
• The nature of immersion silver layers is sensitive and ready to work on
• With that there is an extra coating of gold such is placed over the copper layer

Immersion Silver Advantages

• It is more expensive than ENIG
• What working life is like HASL

• Disadvantage Immersion Silver

• It can be stored in one single day
• It is not used for plated through-hole

ENEPIG

• This technique is new to PCB finishing and the first time used in after 90s.
• Three layers of gold, palladium, and nickel enhance the use of these features on boards since it come with lots of advantages to board.
• There is a lot of new features are introduced in this finishing to fulfill the reliable, ROHS standards and requirements for packaging.

ENEPIG Advantages

• There is no occurrence of black pad risk.
• Its operating life is more than one year.
• It is coated with three layers that save it from corrosion.
• There is fine solders points on the board.

ENEPIG Disadvantages:

• Its processing is restricted to a certain level.
• It is a costly process
• There are some restrictions used to make it effective again.

Tin Immersion

• The use of tin very helpful in the case when there is oxidation occurs. There is a mixing process easy for copper and tin that increases the operating or shelf life of the PCB board.
• Through this process, a reliable board with lower prices can be obtained.
• It is not good for the through-hole technique.

Faqs

So, depending on your use, you can choose any overhead PCB surface finishing technique. PCBWay offers all the results for any of your project necessities at a reasonable charge