Introduction to SMT PCB Reflow Soldering Process

Hello, readers welcome to the new tutorial here we will learn Introduction to SMT Reflow soldering Process. It is currently used technique for the creation of PCB boards. This technique helps to make larger levels of products by permitting the elements to eliminate from the real soldering technique. This module helps to connect larger numbers of elements and makes it easy to assemble.

In this post we will cover all basis of this process and learn how it can be used for the creation of reliable and less expensive boards also learn how get the SMT services form JLCPCB which is the best PCB supplier and offers the PCB services with SMT at good prices and features. SO let’s get started.

Introduction to SMT Reflow soldering Process

• In this process solder paste is applied to make the temporary connection of components on the board and after that heating is applied.

 

• The molted solder paste makes the long-lasting solder connection.
• For the heating process, there can be use of the reflow oven infrared lamp and through desoldering hot air pencil.
• Due to the usage of long industrial convection ovens, this process is preferred for SMT and PCB printing.
• Every part of the oven has a certain value of temperature that is used for every component’s demand.
• Reflow ovens can also be employed for through-hole process by applying the solder paste in the holes and placing the pins of components in the paste.

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Reflow Soldering Process

• There must be certain precautions taken to place the solder material finely at the board through the application of solder paste stencil.
• After that elements choose at the pad through use of the pick place technique.
• There are some steps followed for reflow soldering are described here.

Preheating

• It is the first step of the soldering process in this process there is the removal of extra solvent added in the solder paste.
• The main fact in this process is the temperature slope rate that is taken in degrees Celsius per second.

Thermal Soak

• When preheating is done board is placed in the soaking module.
• In this process, two areas were observed first one the place that is not heated in the heating process and the second one is to remove the solder paste extra and enhance the flux.

 

Reflow Process

• In this stage, the largest temperatures of the soldering process is get. Here solder is melted and made the compulsory solder joints.
• In this process, flux decreases the surface tension at the metallic joins in results metallurgical bonding get permitting the single solder powder component mix and melt.

Cooling

• In this last stage, there is board is cooled slowly and joints become solid.
• Proper cooling constraints additional intermetallic development to the components.
• The value of temperature in this stage is about thirty to one hundred centigrade.
• For getting the accurate structure of grain there is a selection of high-speed cooling.
• Different the extreme ramp-up proportion, the ramp–down proportion is frequently overlooked. It might be that the ramp degree is less critical overhead certain temperatures, though, the extreme permissible slope for any constituent must apply whether the constituent is heating cooling
• Normally cooling rate is four centigrade per second.

That is all about the SMT PCB Reflow Soldering Process. I have explained all details about this post and also have explained how you can get the best SMT service by JLCPCB.